TRF7970A
SLOS743K – AUGUST 2011 – REVISED APRIL 2014
www.ti.com
5.4
Handling Ratings
MIN
MAX
UNIT
T STG
Storage temperature range
-55
150
°C
V (ESD)
Electrostatic discharge
Human-Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
-2
2
kV
Charged-Device Model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
Machine Model (MM)
-500
-200
500
200
V
V
(1)
(2)
5.5
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2 kV
may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 500 V
may actually have higher performance.
Thermal Characteristics
PACKAGE
θ JC
θ JA (1)
POWER RATING (2)
T A ≤ 25°C T A ≤ 85°C
RHB (32 pin)
31°C/W
36.4°C/W
2.7 W
1.1 W
(1)
(2)
5.6
This data was taken using the JEDEC standard high-K test PCB.
Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to increase substantially.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-
term reliability.
Switching Characteristics
TYP operating conditions are T A = 25°C, VIN = 5 V, full-power mode (unless otherwise noted)
MIN and MAX operating conditions are over recommended ranges of supply voltage and operating free-air temperature
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
t LO/HI
DATA_CLK time high or low, one half of
DATA_CLK at 50% duty cycle
Depends on capacitive load on the I/O lines
(1)
250
62.5
50
ns
t STE,LEAD
t STE,LAG
Slave select lead time, slave select low to
clock
Slave select lag time, last clock to slave
select high
200
200
ns
ns
Slave select disable time, slave select
t STE,DIS
rising edge to next slave select falling
300
ns
edge
t SU,SI
t HD,SI
t SU,SO
t HD,SO
MOSI input data setup time
MOSI input data hold time
MISO input data setup time
MISO input data hold time
15
15
15
15
ns
ns
ns
ns
t VALID,SO
MISO output data valid time
DATA_CLK edge to MISO valid, C L ≤ 30 pF
30
50
75
ns
(1)
Recommended DATA_CLK speed is 2 MHz. Higher data clock depends on the capacitive load. Maximum SPI clock speed should not
exceed 10 MHz. This clock speed is acceptable only when external capacitive load is less than 30 pF. MISO driver has a typical output
resistance of 400 Ω (12-ns time constant when 30-pF load used).
10
Specifications
Submit Documentation Feedback
Product Folder Links: TRF7970A
Copyright ? 2011–2014, Texas Instruments Incorporated
相关PDF资料
TRM-418-LT TRANSCEIVER RF 418MHZ LT SERIES
TRM-900-NT RF TXRX 915MHZ NT SERIES
TRX08GVP2540 TXRX OPT SCFF 8.5GB/S 850NM
TS-320240BRNO TCH PANEL 140X104 RESISTIVE MONO
TS-TFT3.5Z TOUCH PANEL 140X1.4.0 TFT
TS3-75B3 SENSOR THERMAL MOXIE NTC 75C
TSL26711FN IC PROXIMITY DETECTOR 6-DFN
TSOP57238TT1 IC IR RCVR MODULE 38KHZ
相关代理商/技术参数
TRF7970ARHBR 功能描述:IC RFID/NFC AFE 13.56MHZ 32QFN RoHS:是 类别:RF/IF 和 RFID >> RFID IC 系列:- 其它有关文件:CR14 View All Specifications 标准包装:1 系列:- RF 型:收发器 频率:13.56MHz 特点:ISO14443-B 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SO 包装:Digi-Reel® 其它名称:497-5719-6
TRF7970ARHBT 功能描述:IC RFID/NFC AFE 13.56MHZ 32QFN RoHS:是 类别:RF/IF 和 RFID >> RFID IC 系列:- 其它有关文件:CR14 View All Specifications 标准包装:1 系列:- RF 型:收发器 频率:13.56MHz 特点:ISO14443-B 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SO 包装:Digi-Reel® 其它名称:497-5719-6
TRF7970ATB 功能描述:RFID应答器 TRF7970A Target Brd RoHS:否 制造商:Murata 存储容量:512 bit 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
TRF79A6AA17LB000 制造商:Opnext 功能描述:XFP FORM FACTOR - Boxed Product (Development Kits)
TRF79A6AA18LB000 制造商:Opnext 功能描述:XFP FORM FACTOR - Boxed Product (Development Kits)
TRF79A6AA19LB000 制造商:Opnext 功能描述:XFP FORM FACTOR - Boxed Product (Development Kits)
TRF79A6AA20LB000 制造商:Opnext 功能描述:XFP FORM FACTOR - Boxed Product (Development Kits)
TRF79A6AA21LB000 制造商:Opnext 功能描述:XFP FORM FACTOR - Boxed Product (Development Kits)